Wafer Facility Consolidation Projects

DPS Engineering was awarded the Multi-Discipline Design for the relocation of manufacturing equipment to consolidate 8 inch wafer capability to one facility in a major Semi-Conductor Facility in Dublin, Ireland.

This project included a total of 140 individual tool packages completed on schedule in a 12 week period and equipment de-install and install packages in a live wafer manufacturing facility.

Some key areas of Design were:

Design of new class 1 clean room arrangements
Detailed shut down and tie in schedules to maintain full operation during construction
Detailed move in and move out plans for relocation of equipment
Structural design for equipment pedestals
Utilities capacity analysis of existing systems, including point of connection management