Final Wafer Packaging Relocation

DPS Engineering was awarded the Basis of Design Study for the relocation of Final wafer packaging process in a major semi-conductor facility in Dublin Ireland.

Some key areas of Design were:

Scope of work required for the installation of a new Chemical Distribution and Waste Treatment Systems into an existing and highly congested live wafer facility.
Fire code reviews to ensure that the installation met with current IBC (International Building Codes) and existing UBC (Uniform Building Codes) under which the facility was first constructed.
Constructability reviews to identify the most cost effective and safest methods of construction in an exiting and live facility.
Proposed layouts for equipment in a class 1 cleanroom as well as layouts for all support areas including chemical and waste systems.
Detailed scope of work with bill of materials to establish a +-10% cost estimate.